Assembly
Define Instruments can apply your design to PCBs, whether they’re single sided, double sided, multi layered or even requiring mixed technologies.
SMT Assembly
Our modern manufacturing facilities include two SMT lines with a total of five Pick & Place machines, so you can rest assured that a technical problem or machine failure on one of our lines won’t hold up your job.
As part of our commitment to high quality SMT, we have recruited a Samsung certified SMT expert from overseas to operate our machinery, and we verify all stages of the SMT process using magnifying cameras. Our team of skilled operators work to IPC610E standards under the supervision of a certified IPC trainer.
TH assembly
Through hole assembly is a very important part of most electronic products. In fact, it can and often does comprise the major proportion of the assembled cost of the product. Understanding the importance of this, we make sure we use a core of skilled and competent operators. We also employ a process engineer to ensure that the processes used are efficient and are optimised to reduce human error.
On complex double sided and multi layered boards, our unique glue dispensing process enables through hole components to be wave soldered.
Mechanical assembly
What sets us apart from our competition is our ability to assemble PCBs in their final consumer casings. This process can involve programming, mounting, crimping of cables and harnesses, and final consumer testing.
By performing this complete process we save our customers valuable time and money, and also achieve greater continuity throughout the QC process.
Lead free assembly
If you are an exporter, then you can’t ignore the global trend towards lead-free PCB assembly. This need not be a daunting process, but must begin at the PCB design stage. We’ve got the expertise to make this transition easy. Click here for more details.

Our Samsung Pick & Place machines can mount components form 0201″ to 42x42mm (0.3mm pitch).
They feature a Flying Vision System, allowing components to be picked up and recognised simultaneously, for high-speed placement.

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FAQ
